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Compact Guide Cylinder, Copper / Fluorine / Silicone-Free and Low Dust Generation 20-/21-/22-MGP Series (Part Number)

Compact Guide Cylinder, Copper / Fluorine / Silicone-Free and Low Dust Generation 20-/21-/22-MGP Series
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  • ■ For selection / technical information and characteristics on SMC air cylinder products,
    check here.

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  • Refer to the manufacturer's catalog for specification and material details.
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Product Description

[20-Series Copper/Fluorine-Free Specifications]
Suitable for use in environments that dislike copper and fluorine materials.
External dimensions are the same as standard products.

[21/22-Series, copper / fluorine / silicone-free + low dust generation]
It supports environments with restrictions on copper-based, fluorine-based, and silicone-based materials.
The structure is the same as the Clean Series (Grease and packaging are different from the Clean Series. )

■ Refer to the table below for details about lead wire / connector specifications.
Part Number
21-MGPL20-30-Y59B
21-MGPL20-30-Y59BL
21-MGPL20-40-Y59BL
21-MGPL20-40-Z73
21-MGPL20-50
21-MGPL20-50-Y59B
21-MGPL20-50-Z73L
21-MGPL20-60Z-M9NWZ
21-MGPL20-75
21-MGPL20-75-Y59BL
21-MGPL20-75-Z73L
21-MGPL20-75-Z73Z
21-MGPL20-100
21-MGPL20-100-M9NW
21-MGPL20-100-M9NWS
21-MGPL20-100-Y59A
21-MGPL20-100-Y59B
21-MGPL20-100-Y59BL
21-MGPL20-100-Z73S
21-MGPL20-125
21-MGPL20-125-M9BW
21-MGPL20-125Z-M9NWL
21-MGPL20-150-Y7NWZS
21-MGPL20-200
21-MGPL20-200-M9BW
21-MGPL20-200-M9NW
21-MGPL20-200-M9NWS
21-MGPL20-200-Y59A
21-MGPL20-200-Z73S
21-MGPL20-250
21-MGPL20-300-Y7NWZS
21-MGPL20-350
21-MGPL20-400-Y59AL
21-MGPL25-10
21-MGPL25-10-A93
21-MGPL25-10-Z73
21-MGPL25-20
21-MGPL25-20-M9B
21-MGPL25-20-M9BL
21-MGPL25-20-M9BW
21-MGPL25-20-Y7NW
21-MGPL25-20-Y59B
21-MGPL25-20-Y59BL
21-MGPL25-20-Y69B
21-MGPL25-20-Z73
21-MGPL25-25
21-MGPL25-30
21-MGPL25-30-M9NWL
21-MGPL25-30-Y7BAL
21-MGPL25-30-Y7NW
21-MGPL25-30-Y59AL
21-MGPL25-30-Y59B
21-MGPL25-30-Y59BL
21-MGPL25-40
21-MGPL25-40-Y59B
21-MGPL25-50
21-MGPL25-50-M9BW
21-MGPL25-50-M9NW
21-MGPL25-50-M9NWL
21-MGPL25-50-Y7NW
21-MGPL25-50-Y59A
21-MGPL25-50-Y59AL
21-MGPL25-75
21-MGPL25-100
21-MGPL25-100-A93
21-MGPL25-100-M9NWL
21-MGPL25-100-M9PWV
21-MGPL25-100-Y59B
21-MGPL25-100-Z73
21-MGPL32-20
21-MGPL32-20-M9BL
21-MGPL32-25
21-MGPL32-25-M9NWZ
21-MGPL32-25-Y59B
21-MGPL32-25-Y59BL
21-MGPL32-50
21-MGPL32-50-M9BW
21-MGPL32-50-M9BWZ
21-MGPL32-50-M9N
21-MGPL32-50-Y59BL
21-MGPL32-75
21-MGPL32-75-M9BW
21-MGPL32-75-Y59B
21-MGPL32-75-Y59BL
21-MGPL32-75Z
21-MGPL32-100
21-MGPL32-100-Y7NWV
21-MGPL32-125
21-MGPL32-125-M9BW
21-MGPL32-125-Y59B
Part NumberPriceMinimum Order Qty.Volume DiscountDays to ShipSố ngày giao hàngCylinder (Tube) Inner Diameter
(Ø)
Stroke
(mm)
Environment, Applications Operating Pressure
(MPa)
Specifications Port thread type Auto Switches Lead Wire The number of the switches Type of Shaft Bearing Type

-

1 Piece(s) Quote 2030Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2030Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ7332Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2060Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcM9NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ7332Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ7352Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20250Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20300Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20350Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 20400Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2510Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2510Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcA930.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2510Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY69B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2520Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2525Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7BA32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2530Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2550Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 2575Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcA930.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9PWV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 25100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -20Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -20Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -25Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -25Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -25Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -25Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -50Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -50Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -50Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -50Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9N0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -50Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -75Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -75Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -75Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -75Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -75Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NWV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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1 Piece(s) Quote -125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

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Basic InformationThông tin cơ bản

Rod Operation Method Single Rods Main Body Shape Guided Cylinder Operation Method Double Acting
Additional Function Standard