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Compact Guide Cylinder, Copper / Fluorine / Silicone-Free and Low Dust Generation 20-/21-/22-MGP Series (Part Number)

Compact Guide Cylinder, Copper / Fluorine / Silicone-Free and Low Dust Generation 20-/21-/22-MGP Series
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    check here.

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  • Refer to the manufacturer's catalog for specification and material details.
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Product Description

[20-Series Copper/Fluorine-Free Specifications]
Suitable for use in environments that dislike copper and fluorine materials.
External dimensions are the same as standard products.

[21/22-Series, copper / fluorine / silicone-free + low dust generation]
It supports environments with restrictions on copper-based, fluorine-based, and silicone-based materials.
The structure is the same as the Clean Series (Grease and packaging are different from the Clean Series. )

■ Refer to the table below for details about lead wire / connector specifications.
Part Number
21-MGPL32-150-Y59BL
21-MGPL32-150Z-M9BL
21-MGPL32-200
21-MGPL32-300
21-MGPL32-300-Y7NWZS
21-MGPL32-350-Y7NWZS
21-MGPL32-400-Y7NWZS
21-MGPL40-25-Y7NW
21-MGPL40-25-Y59AL
21-MGPL40-25-Y59BL
21-MGPL40-40
21-MGPL40-40-M9BWL
21-MGPL40-40-M9NWL
21-MGPL40-50
21-MGPL40-50-M9PWV
21-MGPL40-50-Y7NW
21-MGPL40-50-Y7NWL
21-MGPL40-50-Y59AL
21-MGPL40-60-Y59A
21-MGPL40-75
21-MGPL40-75-M9BL
21-MGPL40-75-Y7NW
21-MGPL40-100
21-MGPL40-150
21-MGPL40-150Z-M9BW
21-MGPL40-200-Y59B
21-MGPL40-350
21-MGPL40-350-M9NL
21-MGPL50-25
21-MGPL50-25-M9BV
21-MGPL50-25-M9BWL
21-MGPL50-50
21-MGPL50-50-Y7NWV
21-MGPL50-50-Y69BL
21-MGPL50-125
21-MGPL50-125-M9NWL
21-MGPL50-125-M9NWZ
21-MGPL50-125-Y7NWL
21-MGPL50-125-Y7NWZ
21-MGPL50-125-Z73
21-MGPL50-150-M9NWL
21-MGPL50-150-M9NWZ
21-MGPL50-150-Y7NWL
21-MGPL50-150-Y7NWZ
21-MGPL50-175
21-MGPL50-175-M9NW
21-MGPL50-175-Y7NW
21-MGPL50-175Z
21-MGPL50-200
21-MGPL50-200-M9NWL
21-MGPL50-200-Y7NWL
21-MGPL63-25
21-MGPL63-25-Z73
21-MGPL63-50
21-MGPL63-100
21-MGPL63-100-Y69BL
21-MGPL63-110
21-MGPL63-125-Y7NWZ
21-MGPL63-200
21-MGPL63-250-Y59A
21-MGPL63-300-Y59AL
22-MGPL12-20
22-MGPL12-20-M9N
22-MGPL12-20-Y59A
22-MGPL12-20-Y59B
22-MGPL12-30
22-MGPL12-30-Y59B
22-MGPL12-30-Y59BL
22-MGPL12-40
22-MGPL12-50
22-MGPL12-50-Z73
22-MGPL12-75-M9BWS
22-MGPL12-75-Y59B
22-MGPL12-75-Y59BS
22-MGPL12-100
22-MGPL12-100-Y59B
22-MGPL12-100-Y59BL
22-MGPL12-125
22-MGPL12-125-Y7PW
22-MGPL12-150
22-MGPL12-150-M9NWLS
22-MGPL12-150-Y59BL
22-MGPL12-200
22-MGPL12-200-Y59BL
22-MGPL16-10
22-MGPL16-10-M9BV
22-MGPL16-10-M9NWVZ
22-MGPL16-10-Y59B
22-MGPL16-20
22-MGPL16-20-M9B
Part NumberPriceMinimum Order Qty.Volume DiscountDays to ShipSố ngày giao hàngCylinder (Tube) Inner Diameter
(Ø)
Stroke
(mm)
Environment, Applications Operating Pressure
(MPa)
Specifications Port thread type Auto Switches Lead Wire The number of the switches Type of Shaft Bearing Type

-

1 Piece(s) Quote -150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcM9B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -300Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -300Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -350Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote -400Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW51Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9PWV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4060Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 4075Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcM9BW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40350Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 40350Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9N32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5025Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9BW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NWV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 5050Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY69B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50175Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50175Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50175Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50175Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1New modelRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcM9NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 50200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 6325Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 6325Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcZ730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 6350Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY69B32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63110Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY7NW52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcWithout auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63250Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 63300Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.1 to 1StandardRcY59A32Ball bushingCopper/fluorine/silicone-free + low dust generation (relief type)

-

1 Piece(s) Quote 1220Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1220Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9N0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1220Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59A0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1220Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1230Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1230Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1230Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12-Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1250Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1250Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Z730.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1275Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9BW0.51Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1275Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 1275Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.51Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12100Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12125Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y7PW0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9NW31Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12150Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

-

1 Piece(s) Quote 12200Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B32Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1610Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1610Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9BV0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1610Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9NWV52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1610Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Y59B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1620Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-Without auto switch--Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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1 Piece(s) Quote 1620Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room0.12 to 1Standard-M9B0.52Ball bushingCopper/fluorine/silicone-free + low dust generation (vacuum type)

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Basic InformationThông tin cơ bản

Rod Operation Method Single Rods Main Body Shape Guided Cylinder Operation Method Double Acting
Additional Function Standard